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For these reasons, BIS is incorporating ECCN 3A904 into the CCL to manage cryogenic cooling programs and specified parts. ECCN 3A904 controls “units rated to supply a cooling electricity bigger than or equal to 600 µW at or underneath a temperature of 0.
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b. Semiconductor wafer fabrication devices suitable for ion implantation and acquiring any of the subsequent:
“GDSII” is an market regular binary file structure representing wire paths, boundaries, constructions, arrays, textual content labels together with other details about the layout of an built-in circuit in hierarchical sort for Digital style and design Automation (EDA) info exchange of built-in circuit or IC format artwork. such a application aids during the reverse engineering of integrated circuits and warrants national stability controls to protect the innovation of integrated circuits with the U.S. and various supplier nations. An illustration of an equal standard to “GDSII” will be open up Artwork program Interchange regular (OASIS).
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d.9. Spatial Atomic Layer Deposition (ALD) tools getting a wafer support System that rotates all-around an axis obtaining any of the next:
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c. “technologies” to the “growth” or “creation” of hydraulic stretch-forming machines and dies therefor, with the manufacture of airframe buildings;
b. “Technology” according to the normal technologies Take note, aside from that controlled by 4E001.a, to the “development” or “creation” of apparatus as follows:
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